The HAVER UFA has been specifically designed for the sieving of ultra-fine materials at critical particle-size cuts of < 300 µm. The screen is stimulated by means of ultrasonic waves at continuously varying frequency. These high-frequency vibrations reduce the frictional resistance between particles and screen, thus reducing the tendency to block and increasing the sieving performance. Consequently, the sieving process is completed faster; for some bulk materials, automated screening only becomes possible with this method.
Single system with clamping ring connector to a generator by means of a converter.